ASTM B579-1973(2004) 锡铅合金的电解沉积镀层(焊接板)

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【英文标准名称】:StandardSpecificationforElectrodepositedCoatingsofTin-LeadAlloy(SolderPlate)
【原文标准名称】:锡铅合金的电解沉积镀层(焊接板)
【标准号】:ASTMB579-1973(2004)
【标准状态】:现行
【国别】:
【发布日期】:1973
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:B08.08.04
【标准类型】:(Specification)
【标准水平】:()
【中文主题词】:覆层;金属的;电解镀层;锡;金属;金属覆层;合金;铅
【英文主题词】:electrodepositedcoatings,tin-leadalloy(solderplate);solder,tin-leadalloy;tin-lead
【摘要】:1.1Thisspecificationcoverstherequirementsforelectrodepositedtin-leadcoatingsonfabricatedarticlesofiron,steel,copper,andcopperalloys,toprotectthemagainstcorrosion(Note1),toimproveandpreservesolderabilityoverlongperiodsofstorage,andtoimproveanti-gallingcharacteristics.Note1-Somecorrosionoftin-leadcoatingsmaybeexpectedinoutdoorexposure.Innormalindoorexposure,tin-leadisprotectiveoniron,copper,andcopperalloys.Corrosionmaybeexpectedatdiscontinuities(pitsorpores)inthecoating.Porositydecreasesasthethicknessisincreased.Aprimaryuseofthetin-leadcoating(solder)iswiththeprintedcircuitindustryasasolderablecoatingandasanetchmaskmaterial.1.2Thisspecificationappliestoelectrodepositedcoatingscontainingaminimumof50%andamaximumof70%tin.Thespecificationappliestomat,bright,andflow-brightenedtin-leadcoatings.Note2-Tin-leadplatingbathsarecomposedoftinandleadfluoboratesandofadditionagentstopromotestability.Thefinalappearancemaybeinfluencedbytheadditionofproprietarybrighteners.Withoutbrighteners,thecoatingsaremat;withbrighteners,theyaresemibrightorbright.Flow-brightenedcoatingsareobtainedbyheatingmatcoatingstoabovethemeltingpointoftin-leadforafewsecondsandthenquenching;palmoil,hydrogenatedoils,orfatsareusedasaheat-transfermediumatatemperatureof260+10176C(500+20176F),butothermethodsofheatingarealsoinuse.Themaximumthicknessforflow-brighteningisabout7.5[mu]m(0.3mil);thickercoatingstendtoreflowunevenly.Theshapeofthepartisalsoafactor;flatsurfacestendtoreflowmoreunevenlythanwiresorroundedshapes(Note3).Note3-Volatileimpuritiesintin-leadcoatingswillcausebubblingandfoamingduringflow-brighteningresultinginvoidsandroughness.Theimpuritiescanarisefromplatingsolutionadditionagentsandfromimproperrinsingandprocessing.1.3Thisspecificationdoesnotapplytosheet,strip,orwireintheunfabricatedformortothreadedarticleshavingbasicmajordiametersuptoandincluding19mm(0.75in.).
【中国标准分类号】:A29
【国际标准分类号】:25_220_40
【页数】:5P.;A4
【正文语种】:


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Product Code:SAE ARP881
Title:Lamps for Aircraft Lighting
Issuing Committee:A-20ac Crew Station And Interior Lighting Committee
Scope:The SAE Aerospace Recommeded Practice (ARP) lists the lamps in Table 1 that are recommended for the type of service indicated as a catalog and does not include many types that are now in use. It does, however, reflect current practice.【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Part11:Rapidchangeoftemperature;Two-fluid-bathmethod
【原文标准名称】:半导体器件.机械和气候试验方法.第11部分:温度的急速变化.双液电镀槽法
【标准号】:IEC60749-11-2002
【标准状态】:现行
【国别】:国际
【发布日期】:2002-04
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:环境试验;试验;组件;机械试验;电子工程;集成电路;气候;半导体;电子设备及元件;气候试验;温度变化;电学测量;半导体器件;电气工程;定义;定义
【英文主题词】:Changesoftemperature;Climate;Climatictests;Components;Definitions;Destructivetesting;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Mechanicaltesting;Semiconductordevices;Semiconductors;Testing
【摘要】:ThispartofIEC60749definestherapidchangeoftemperaturetestmethodandthetwo-fluid-bathmethod.Whenbothtestmethodsareperformedaspartofadevicequalification,resultsofairtoairtemperaturecyclingtakepriorityoverthistwo-fluid-bathtestmethod.Thistestmethodmayalsobeused,employingfewercycles(e.g.5to10cycles),totesttheeffectofimmersioninheatedliquidsthatareusedforthepurposeofcleaningdevices.Thistestisapplicabletoallsemiconductordevices.Itisconsidereddestructiveunlessotherwisedetailedintherelevantspecification.Ingeneral,thisrapidchangeoftemperatureandtwo-fluidbathmethodtestisinconformitywithIEC60068-2-14but,duetospecificrequirementsofsemiconductors,theclausesofthisstandardapply.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:13P.;A4
【正文语种】:英语